Part # SMTSK-6060-4 ET, SMTSK™ REELFAST® KEYHOLE® Standoffs

PEM® surface mounted standoffs that eliminate the need for attaching screws

PEM® SMTSK™ standoffs are designed so that a PC board or panel can be quickly slipped into place and then removed from an assembly by simply sliding the board sideways and lifting it off. These standoffs mount on PC Boards in the same manner and at the same time as other surface mount components prior to the automated reflow solder process.

Reduces scrap, handling and risk of board damage.

Unique barrel design allows for quick attachment and detachment.

Makes horizontal or vertical component mounting possible.

Provided on tape and reel compatible with existing SMT automated installation equipment.

Unit of Measure

Specifications

L - Length ± .005¹	N/A .125 in
Min. Sheet Thickness	N/A .060 in
A Max.	N/A .060 in
C Max.	N/A .161 in
E ± .005	N/A .250 in
B ± .003	N/A .177 in
P ± .003	N/A .099 in
R Max.	N/A .212 in
S ± .003	N/A .068 in
M Max.	N/A .108 in
øH - Hole Size in Sheet + .003 - .000	N/A .166 in
øD - Min. Solder Pad	N/A .276 in
Parts per Reel²	N/A 630
Fastener Material	N/A Carbon Steel
Standard Finish³	N/A Electro-plated tin ASTM B 545, Class B with clear preservative coating, annealed
Bottom Mounting Hole B + .003 -.000	N/A .166 in
Min. Thickness - Panel 1 (Bottom)	N/A .060 in
Thickness Range - Panel 2 (Top)	N/A .057 to .064 in
Material - Panel 1 (Bottom)	N/A PC Board
Material - Panel 2 (Top)	N/A ANY
Edge Distance C2 Min.⁴	N/A .160 in
Location Tolerance	N/A ±.005 in
Max. Hardness - Panel 1 (Bottom)	N/A No Limit
Max. Hardness - Panel 2 (Top)	N/A No Limit
CAD Supplier	N/A PennEngineering® (PEM®)
Inventory	N/A {0}

¹ The “L” dimension is the height of the installed stud at max grip. The height of the stud will increase if it is installed into thinner material. To calculate “actual L” use this formula: max grip - actual grip + L = “actual L”
² Packaged on 13" recyclable reels. Tape width is 24mm and 16mm. Pitch is 16mm and 12mm. Reels conform to EIA-481.
³ (1) See PEM® Technical Support section of our website for related plating standards and specifications.
(2) Optimal solderability life noted on package.
(3) The tin deposit on SMTSK standoffs meet the requirements of ASTM B545, Class A and althoug
⁴ To minimize sheet distortion and maximize product performance, use a centerline-to-edge value greater or equal to the value specified.

Specifications

Min. Sheet Thickness

A Max.

C Max.

E ± .005

B ± .003

P ± .003

R Max.

S ± .003

M Max.

øH - Hole Size in Sheet + .003 - .000

øD - Min. Solder Pad

Fastener Material

Bottom Mounting Hole B + .003 -.000

Min. Thickness - Panel 1 (Bottom)

Thickness Range - Panel 2 (Top)

Material - Panel 1 (Bottom)

Material - Panel 2 (Top)

Location Tolerance

Max. Hardness - Panel 1 (Bottom)

Max. Hardness - Panel 2 (Top)

CAD Supplier

Inventory